Technical Support
                                                                                        FAQ
                                                                                        What is different between Low Pressure Molding and Epoxy Potting?

                                                                                        PA Hot melt LPM

                                                                                        Epoxy molding

                                                                                        Case

                                                                                        Need

                                                                                        Meed case

                                                                                        Working temperature

                                                                                        -70~150℃

                                                                                        180℃

                                                                                        Housing

                                                                                        No need housing

                                                                                        Need housing

                                                                                        Cycle time

                                                                                        2-60 seconds

                                                                                        Chemical reaction needs 24 hours

                                                                                        density

                                                                                        0.98

                                                                                        Above 1.2

                                                                                        Curing

                                                                                        Much less curing time

                                                                                        Need curing

                                                                                        Working space

                                                                                        Occupy less space

                                                                                        Occupy large space

                                                                                        Energy consumption

                                                                                        Low

                                                                                        High

                                                                                        Resin consumption

                                                                                        Less

                                                                                        Much more

                                                                                        Process

                                                                                        Simple

                                                                                        Complex

                                                                                        Vacuum pumping

                                                                                        No need

                                                                                        Need 

                                                                                        Hits:  UpdateTime:2018-09-14 15:08:00  【Printing】  【Close
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